Invention Application
US20150260593A1 MIRCO-ELECTRO-MECHANICAL SYSTEM PRESSURE SENSOR AND MANUFACTURING METHOD THEREOF
审中-公开
微电子机械系统压力传感器及其制造方法
- Patent Title: MIRCO-ELECTRO-MECHANICAL SYSTEM PRESSURE SENSOR AND MANUFACTURING METHOD THEREOF
- Patent Title (中): 微电子机械系统压力传感器及其制造方法
-
Application No.: US14329111Application Date: 2014-07-11
-
Publication No.: US20150260593A1Publication Date: 2015-09-17
- Inventor: Yu-Wen Hsu , Chia-Yu Wu , Shih-Chieh Lin , Shih-Ting Lin
- Applicant: Yu-Wen Hsu , Chia-Yu Wu , Shih-Chieh Lin , Shih-Ting Lin
- Applicant Address: TW ZHUBEI CITY
- Assignee: RICHTEK TECHNOLOGY CORPORATION
- Current Assignee: RICHTEK TECHNOLOGY CORPORATION
- Current Assignee Address: TW ZHUBEI CITY
- Priority: TW103109852 20140317; TW103119642 20140606
- Main IPC: G01L9/00
- IPC: G01L9/00 ; B81B7/00 ; B81C1/00

Abstract:
The invention provides a micro-electro-mechanical system pressure sensor. The micro-electro-mechanical system pressure sensor includes: a substrate, including at least one conductive wiring; a membrane disposed above the substrate to form a semi-open chamber between the membrane and the substrate, the semi-open chamber having an opening to receive an external pressure; and a cap, disposed above the membrane and forming an enclosed space with the membrane, the cap including a top electrode corresponding to the membrane and at least one portion of the membrane forming a bottom electrode, wherein the top and bottom electrodes form a sensing capacitor to sense the external pressure.
Information query