Invention Application
US20150264795A1 SUSPENSION BOARD WITH CIRCUIT, PRODUCING METHOD THEREOF, AND POSITIONING METHOD OF SUSPENSION BOARD WITH CIRCUIT
有权
具有电路的悬挂板，其制造方法以及具有电路的悬架板的定位方法
- Patent Title: SUSPENSION BOARD WITH CIRCUIT, PRODUCING METHOD THEREOF, AND POSITIONING METHOD OF SUSPENSION BOARD WITH CIRCUIT
- Patent Title (中): 具有电路的悬挂板，其制造方法以及具有电路的悬架板的定位方法
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Application No.: US14686143Application Date: 2015-04-14
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Publication No.: US20150264795A1Publication Date: 2015-09-17
- Inventor: Yasunari OOYABU , Tetsuya OHSAWA , Emiko TANI
- Applicant: NITTO DENKO CORPORATION
- Applicant Address: JP Osaka
- Assignee: NITTO DENKO CORPORATION
- Current Assignee: NITTO DENKO CORPORATION
- Current Assignee Address: JP Osaka
- Priority: JP2008-202666 20080806
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H05K3/06
Abstract:
A suspension board with circuit includes a metal supporting board, a conductive layer laminated on the metal supporting board, and a via layer interposed between the metal supporting board and the conductive layer. The conductive layer includes a conductive pattern, and a reference portion serving as a positioning reference for placing the suspension board with circuit on a load beam.
Public/Granted literature
- US10028370B2 Suspension board and load beam combination including a positioning reference hole and a reinforcing layer Public/Granted day:2018-07-17
Information query
