发明申请
US20150276480A1 Non-Destructive 3-Dimensional Chemical Imaging Of Photo-Resist Material
审中-公开
光致抗蚀材料的非破坏性三维化学成像
- 专利标题: Non-Destructive 3-Dimensional Chemical Imaging Of Photo-Resist Material
- 专利标题(中): 光致抗蚀材料的非破坏性三维化学成像
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申请号: US14229909申请日: 2014-03-29
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公开(公告)号: US20150276480A1公开(公告)日: 2015-10-01
- 发明人: Nilanjan GHOSH , Kevin T. MCCARTHY , Zhiyong WANG , Deepak GOYAL , Changhua LIU , Leonel R. ARANA
- 申请人: Nilanjan GHOSH , Kevin T. MCCARTHY , Zhiyong WANG , Deepak GOYAL , Changhua LIU , Leonel R. ARANA
- 主分类号: G01J3/28
- IPC分类号: G01J3/28 ; G01J3/04 ; G01J3/44
摘要:
Embodiments include devices, systems and processes for using a combined confocal Raman microscope for inspecting a photo resist film material layer formed on the top surface of a layer of a substrate package, to detect border defects between regions of light exposed (e.g., cured) and unexposed (e.g., uncured) resist film material. Use of the confocal Raman microscope may provide a 3D photo-resist chemical imaging and characterization technique based on combining (1) Raman spectroscopy to identify the borders between regions of light exposed and unexposed resist along XY planes, with (2) Confocal imaging to select a Z-height of the XY planes scanned. Such detection provides fast, high resolution, non-destructive in-line inspection, and improves technical development of polymerization profiles of the resist film material.
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