发明申请
- 专利标题： HIGH-ASPECT-RATIO IMPRINTED STRUCTURE
- 专利标题（中）： 高度比例显影结构
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申请号： US14230021申请日： 2014-03-31
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公开(公告)号： US20150276988A1公开(公告)日： 2015-10-01
- 发明人: Ronald Steven Cok
- 申请人： Ronald Steven Cok
- 主分类号： G02B1/10
- IPC分类号： G02B1/10
摘要：
A high-aspect-ratio imprinted structure includes a first layer of cured layer material having a plurality of micro-channels imprinted in the first layer. Each micro-channel has micro-channel walls and a micro-channel bottom, the micro-channel bottom having distinct first and second portions. Deposited material is located on the micro-channel walls and not on the second portion of the micro-channel bottom.
公开/授权文献
- US09519080B2 High-aspect-ratio imprinted structure 公开/授权日：2016-12-13