Invention Application
- Patent Title: MULTI-COIL MODULE AND ELECTRONIC DEVICE
- Patent Title (中): 多线圈模块和电子设备
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Application No.: US14443171Application Date: 2013-10-24
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Publication No.: US20150280322A1Publication Date: 2015-10-01
- Inventor: Norio Saito , Hiroyuki Ryoson , Katsuhisa Orihara
- Applicant: DEXERIALS CORPORATION
- Priority: JP2012-251543 20121115
- International Application: PCT/JP2013/078775 WO 20131024
- Main IPC: H01Q7/06
- IPC: H01Q7/06 ; H02J7/02 ; H01Q1/22 ; H02J5/00

Abstract:
The loss is reduced even when loop coils of a multi-coil module are overlaid with each other. The multi-coil module includes a first coil module, having a first magnetic sheet and a first loop coil provided on the first magnetic sheet and wound in a planar shape, and a second coil module, having a second magnetic sheet and a second loop coil provided on the second magnetic sheet and wound in a planar shape. The first coil module and the second coil module are stacked on each other, and at least an innermost coil pattern of the first loop coil and the second loop coil are overlaid with each other. The line width of the innermost coil pattern t of the first loop coil overlaid with the second loop coil is 1 mm or less.
Public/Granted literature
- US09634392B2 Multi-coil module and electronic device Public/Granted day:2017-04-25
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