Invention Application
US20150281828A1 HEADPHONES AND EAR PAD 有权
耳机和耳垫

  • Patent Title: HEADPHONES AND EAR PAD
  • Patent Title (中): 耳机和耳垫
  • Application No.: US14370946
    Application Date: 2012-11-30
  • Publication No.: US20150281828A1
    Publication Date: 2015-10-01
  • Inventor: Osamu Horikawa
  • Applicant: D&M Holdings, Inc.
  • Priority: JP2011-288541 20111228
  • International Application: PCT/JP2012/081029 WO 20121130
  • Main IPC: H04R1/10
  • IPC: H04R1/10
HEADPHONES AND EAR PAD
Abstract:
[Problem] To prevent sound leakage through gaps between the wearing surface side of ear pads and areas around the ears when headphones are worn and used by a user. [Solution] For headphones that have ear pads which are attached to the surfaces of housing sections, each having a built-in speaker driver for outputting an audio signal as sound, which come in contact with the ears of a listener, convex sections in the form of gradually curved surfaces are provided in the wearing surface regions of the ear pads that come in contact with an upper anterior side of the head of the listener and a lower posterior side of the head of the listener, whereby the ear pads are shaped to fit well to the areas around the ears of the user without forming any gaps when the ear pads are worn.
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