Invention Application
US20150288085A1 EDGE MOUNT CONNECTOR ARRANGEMENT WITH IMPROVED CHARACTERISTIC IMPEDANCE
有权
边缘安装连接器安装具有改进的特性阻抗
- Patent Title: EDGE MOUNT CONNECTOR ARRANGEMENT WITH IMPROVED CHARACTERISTIC IMPEDANCE
- Patent Title (中): 边缘安装连接器安装具有改进的特性阻抗
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Application No.: US14679892Application Date: 2015-04-06
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Publication No.: US20150288085A1Publication Date: 2015-10-08
- Inventor: Alfredo Moncayo , Brian Hostetter , Luis F. Armenta
- Applicant: Mindspeed Technologies, Inc.
- Main IPC: H01R12/57
- IPC: H01R12/57 ; H05K1/02 ; H05K1/11

Abstract:
An electrical interface on a circuit board is disclosed for electrically connecting the circuit board to a connector to reduce reflections and impedance mismatch and increase power transfer from the connector to the signal path of the circuit board. The signal interface includes a signal conductor including a signal pad configured to connect to a connector pin and a waveguide section extending from the signal pad. The waveguide narrows from a signal pad width to connect to a microstrip conductor. A first ground section is spaced rightward from the signal conductor such that the inner edge of the first ground section, angles in correspondence with the narrowing of the waveguide to generally track an outer right edge of the waveguide. A second ground section is spaced leftward from the signal conductor and configured generally similarly to the first ground section.
Public/Granted literature
- US09433083B2 Edge mount connector arrangement with improved characteristic impedance Public/Granted day:2016-08-30
Information query
IPC分类: