A microelectromechanical system (MEMS) die includes a back plate and a diaphragm assembly. The back plate includes a first back plate portion including a first electrode and a second back plate portion including a second electrode, both electrodes being integrated on a mechanical supporting layer. The diaphragm assembly includes a first diaphragm disposed proximate to and in spaced apart relation from the first back plate portion, with the first diaphragm defining an opening therethrough. The diaphragm assembly also includes a second diaphragm disposed proximate to and in spaced apart relation from the second back plate portion, the second diaphragm disposed within the opening and separated from the first diaphragm by a ring-shaped void. The diaphragm assembly also includes a connection portion connecting the first diaphragm and the second diaphragm and extending through the ring-shaped void.