发明申请
US20150311118A1 DICING TAPE PROTECTION FOR WAFER DICING USING LASER SCRIBE PROCESS
有权
使用激光扫描工艺制造的波纹贴片保护
- 专利标题： DICING TAPE PROTECTION FOR WAFER DICING USING LASER SCRIBE PROCESS
- 专利标题（中）： 使用激光扫描工艺制造的波纹贴片保护
-
申请号： US14272101申请日： 2014-05-07
-
公开(公告)号： US20150311118A1公开(公告)日： 2015-10-29
- 发明人: Wei-Sheng Lei , Brad Eaton , Ajay Kumar
- 申请人： Wei-Sheng Lei , Brad Eaton , Ajay Kumar
- 主分类号： H01L21/78
- IPC分类号： H01L21/78 ; H01L21/683
摘要：
Methods of and apparatuses for dicing semiconductor wafers, each wafer having a plurality of integrated circuits, are described. In an example, a method of scribing a semiconductor wafer having a plurality of integrated circuits involves adhering a backside of a semiconductor wafer to an inner portion of a carrier tape of a substrate carrier that includes a tape frame mounted above the carrier tape. The method also involves overlaying a protective frame above a front side of the semiconductor wafer and above an exposed outer portion of the carrier tape, the protective frame having an opening exposing an inner region of the front side of the semiconductor wafer. The method also involves laser scribing the front side of the semiconductor wafer with the protective frame in place.
公开/授权文献
信息查询
IPC分类:
