发明申请
US20150321905A1 WAFER LEVEL PACKAGED INFRARED (IR) FOCAL PLANE ARRAY (FPA) WITH EVANESCENT WAVE COUPLING
有权
WAFER LEVEL包装红外(IR)FOCAL PLANE ARRAY(FPA)与EVANESCENT WAVE COUPLING
- 专利标题: WAFER LEVEL PACKAGED INFRARED (IR) FOCAL PLANE ARRAY (FPA) WITH EVANESCENT WAVE COUPLING
- 专利标题(中): WAFER LEVEL包装红外(IR)FOCAL PLANE ARRAY(FPA)与EVANESCENT WAVE COUPLING
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申请号: US14270945申请日: 2014-05-06
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公开(公告)号: US20150321905A1公开(公告)日: 2015-11-12
- 发明人: Roland W. Gooch , Stephen H. Black , Thomas A. Kocian , Adam M. Kennedy , Buu Q. Diep
- 申请人: Raytheon Company
- 申请人地址: US MA Waltham
- 专利权人: RAYTHEON COMPANY
- 当前专利权人: RAYTHEON COMPANY
- 当前专利权人地址: US MA Waltham
- 主分类号: B81B7/00
- IPC分类号: B81B7/00 ; H01L37/00
摘要:
A structure for detecting electromagnetic radiation having a predetermined wavelength. The structure includes a device wafer having a sensing element disposed on a predetermined region of a surface of the device wafer responsive to the electromagnetic radiation. A cover wafer is provided having a region thereof transparent to the electromagnetic radiation for passing the electromagnetic radiation through the transparent region onto a surface of the sensing element. A bond gap spacer structure is provided for supporting the surface of the sensing element from an opposing surface of the transparent region of the cover wafer a distance less than a fraction of the predetermined wavelength when. the cover wafer is bonded to the device wafer.
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