Invention Application
- Patent Title: Silver Based Conductive Layer for Flexible Electronics
- Patent Title (中): 银导电层柔性电子学
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Application No.: US14807336Application Date: 2015-07-23
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Publication No.: US20150327366A1Publication Date: 2015-11-12
- Inventor: Mohd Fadzli Anwar Hassan , Guowen Ding , Minh Huu Le , Minh Anh Anh Nguyen , Zhi-Wen Wen Sun , Guizhen Zhang
- Applicant: Intermolecular Inc.
- Main IPC: H05K1/09
- IPC: H05K1/09 ; H05K1/02

Abstract:
Methods for making conducting stacks includes forming a doped or alloyed silver layer sandwiched between two layers of transparent conductive oxide such as indium tin oxide (ITO). The doped silver or silver alloy layer can be thin, such as between 1.5 to 20 nm and thus can be transparent. The doped silver or silver alloy can provide improved ductility property, allowing the conductive stack to be bendable. The transparent conductive oxide layers can also be thin, allowing the conductive stack can have improved ductility property.
Public/Granted literature
- US09408303B2 Silver based conductive layer for flexible electronics Public/Granted day:2016-08-02
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