Invention Application
- Patent Title: Electronic Device Package Including Metal Blocks
- Patent Title (中): 包括金属块的电子器件封装
-
Application No.: US14279752Application Date: 2014-05-16
-
Publication No.: US20150332938A1Publication Date: 2015-11-19
- Inventor: Petteri Palm , Edward Fuergut , Irmgard Escher-Poeppel
- Applicant: Infineon Technologies AG
- Main IPC: H01L21/56
- IPC: H01L21/56 ; H01L25/065 ; H01L21/78
Abstract:
A method of manufacturing an electronic device package includes structuring a metal layer to generate a structured metal layer having a plurality of openings. Semiconductor chips are placed into at least some of the openings. An encapsulating material is applied over the structured metal layer and the semiconductor chips to form an encapsulation body. The encapsulation body is separated into a plurality of electronic device packages.
Public/Granted literature
- US09768037B2 Electronic device package including metal blocks Public/Granted day:2017-09-19
Information query
IPC分类:
