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Invention Application
US20150357094A1 PROCESS AND APPARATUS FOR PRODUCING SHIELD LAYER-CUT ELECTRIC WIRE 有权
用于生产屏蔽层切割电线的工艺和装置

  • Patent Title: PROCESS AND APPARATUS FOR PRODUCING SHIELD LAYER-CUT ELECTRIC WIRE
  • Patent Title (中): 用于生产屏蔽层切割电线的工艺和装置
  • Application No.: US14297028
    Application Date: 2014-06-05
  • Publication No.: US20150357094A1
    Publication Date: 2015-12-10
  • Inventor: Kanji Ishigure
  • Applicant: Asahi Seiki Co., Ltd.
  • Applicant Address: JP Gifu-shi
  • Assignee: Asahi Seiki Co., Ltd.
  • Current Assignee: Asahi Seiki Co., Ltd.
  • Current Assignee Address: JP Gifu-shi
  • Main IPC: H01B15/00
  • IPC: H01B15/00
PROCESS AND APPARATUS FOR PRODUCING SHIELD LAYER-CUT ELECTRIC WIRE
Abstract:
Disclosed are a simplified process and apparatus for producing a shield layer-cut electric wire that does not damage an insulating layer and a core wire and when cutting a shield layer.
Abstract(Chinese):

公开了一种用于制造不损坏绝缘层和芯线以及切割屏蔽层的屏蔽层切割电线的简化工艺和装置。

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