A package substrate includes an inner interlayer, a first conductor layer on the inner interlayer, a second conductor layer on which the inner interlayer is formed, an outermost interlayer on the first conductor layer, an outermost conductor layer on the outermost interlayer and including first and second pads positioned to mount first and second electronic components on the outermost interlayer, outermost vias connecting the first and outermost conductor layers through the outermost interlayer, and skip vias connecting the outermost and second conductor layers through the outermost and inner interlayers. The first conductor layer includes a first circuit connecting two outermost vias, and the outermost conductor layer includes an outermost circuit connecting one of the two outermost vias and one skip via such that the first conductor circuit, two outermost vias, outermost circuit and one skip via form a connection path connecting one second pad and the second conductor layer.