A method of distressing a board is disclosed. In one embodiment, the method comprises: a) supporting the board on a material support, the board having a substantially planar surface; b) providing a blade having a front surface and a curved back cutting surface, the front surface and the curved back cutting surface intersecting to form a curved tip; c) directing the blade and the substantially planar surface into cutting contact; and d) generating relative movement between the blade and the board to distress a portion of the substantially planar surface; and wherein during step d), the blade is maintained in a fixed orientation relative to the substantially planar surface of the board so that an obtuse mount angle is maintained.