Invention Application
- Patent Title: SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THE SAME
- Patent Title (中): 半导体器件及其制造方法
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Application No.: US14731764Application Date: 2015-06-05
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Publication No.: US20150364474A1Publication Date: 2015-12-17
- Inventor: HEE-WOONG KANG , SUEJIN KIM , HEEWON LEE
- Applicant: HEE-WOONG KANG , SUEJIN KIM , HEEWON LEE
- Priority: KR10-2014-0070959 20140611
- Main IPC: H01L27/108
- IPC: H01L27/108 ; H01L23/528 ; H01L49/02

Abstract:
A semiconductor device includes a substrate, a memory structure and a capacitor structure including at least one array of capacitors. The memory structure is disposed in a first region of the device. The capacitor structure is disposed in a second region of the device. The capacitor structure may include a first capacitor array, a second capacitor array, a third capacitor array and a first landing pad. The first landing pad is disposed between the substrate and lower electrodes of capacitors of the first and second capacitor arrays, and contacts the lower electrodes so as to electrically connect the first capacitor array and the second capacitor array. Upper electrodes of capacitors of the second and third capacitor arrays are integral such that the second capacitor array and the third capacitor array are electrically connected to each other.
Public/Granted literature
- US09806080B2 Semiconductor devices and methods of manufacturing the same Public/Granted day:2017-10-31
Information query
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