发明申请
- 专利标题: DEVICES FORMED WITH TECHNIQUES FOR BONDING SUBSTRATES USING AN INTERMEDIATE LAYER
- 专利标题(中): 使用中间层结合基板的技术形成的设备
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申请号: US14837743申请日: 2015-08-27
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公开(公告)号: US20150367598A1公开(公告)日: 2015-12-24
- 发明人: David A. Ruben , Michael S. Sandlin
- 申请人: Medtronic, Inc.
- 主分类号: B32B7/04
- IPC分类号: B32B7/04 ; H05K1/18 ; H05K1/11 ; H05K1/03
摘要:
A method includes depositing a thin film on a first surface of a first substrate and moving a second surface of a second substrate into contact with the thin film such that the thin film is located between the first and second surfaces. The method further includes generating electromagnetic (EM) radiation of a first wavelength, the first wavelength selected such that the thin film absorbs EM radiation at the first wavelength. Additionally, the method includes directing the EM radiation through one of the first and second substrates and onto a region of the thin film until the first and second substrates are fused in the region.
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