发明申请
US20150367598A1 DEVICES FORMED WITH TECHNIQUES FOR BONDING SUBSTRATES USING AN INTERMEDIATE LAYER 有权
使用中间层结合基板的技术形成的设备

DEVICES FORMED WITH TECHNIQUES FOR BONDING SUBSTRATES USING AN INTERMEDIATE LAYER
摘要:
A method includes depositing a thin film on a first surface of a first substrate and moving a second surface of a second substrate into contact with the thin film such that the thin film is located between the first and second surfaces. The method further includes generating electromagnetic (EM) radiation of a first wavelength, the first wavelength selected such that the thin film absorbs EM radiation at the first wavelength. Additionally, the method includes directing the EM radiation through one of the first and second substrates and onto a region of the thin film until the first and second substrates are fused in the region.
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