发明申请
- 专利标题： Bonded Structures for Package and Substrate
- 专利标题（中）： 包装和基材的结合结构
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申请号： US14840811申请日： 2015-08-31
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公开(公告)号： US20150371964A1公开(公告)日： 2015-12-24
- 发明人: Ming-Hong Cha , Chen-Shien Chen , Chen-Cheng Kuo , Tsung-Hsien Chiang , Hao-Juin Liu , Yao-Chun Chuang , Chita Chuang
- 申请人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 主分类号： H01L23/00
- IPC分类号： H01L23/00
摘要：
The embodiments described provide elongated bonded structures near edges of packaged structures free of solder wetting on sides of copper posts substantially facing the center of the packaged structures. Solder wetting occurs on other sides of copper posts of these bonded structures. The elongated bonded structures are arranged in different arrangements and reduce the chance of shorting between neighboring bonded structures. In addition, the elongated bonded structures improve the reliability performance.
公开/授权文献
- US09397059B2 Bonded structures for package and substrate 公开/授权日：2016-07-19
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