Invention Application
US20160009969A1 Holt Melt Adhesive And Method Of Forming The Same 审中-公开
Holt熔融粘合剂及其形成方法

Holt Melt Adhesive And Method Of Forming The Same
Abstract:
A hot melt adhesive (HMA), which is solid at room temperature, comprises the reaction product of 5 to 25% by weight of an isocyanate component having an NCO content of from about 20 to about 50% by weight, 75 to 85% by weight of a polyester, and 1 to 10% by weight of a hydroxy-polymer having an OH number of from about 40 to about 50. A method of forming the adhesive comprises the step of combining the isocyanate component, polyester, and hydroxy-polymer to form the adhesive. The adhesive can be used for various purposes, such as for forming an adhesive layer which adhesively couples surfaces together.
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