Invention Application
- Patent Title: Holt Melt Adhesive And Method Of Forming The Same
- Patent Title (中): Holt熔融粘合剂及其形成方法
-
Application No.: US14771987Application Date: 2014-03-04
-
Publication No.: US20160009969A1Publication Date: 2016-01-14
- Inventor: Rajesh Kumar , Nikolay Lebedinski , Lyle Andrew Caillouette
- Applicant: BASF SE
- International Application: PCT/US2014/020294 WO 20140304
- Main IPC: C09J175/06
- IPC: C09J175/06 ; B32B21/00 ; B32B15/00 ; B32B7/12

Abstract:
A hot melt adhesive (HMA), which is solid at room temperature, comprises the reaction product of 5 to 25% by weight of an isocyanate component having an NCO content of from about 20 to about 50% by weight, 75 to 85% by weight of a polyester, and 1 to 10% by weight of a hydroxy-polymer having an OH number of from about 40 to about 50. A method of forming the adhesive comprises the step of combining the isocyanate component, polyester, and hydroxy-polymer to form the adhesive. The adhesive can be used for various purposes, such as for forming an adhesive layer which adhesively couples surfaces together.
Public/Granted literature
- US09719000B2 Hot melt adhesive and method of forming the same Public/Granted day:2017-08-01
Information query
IPC分类: