Invention Application
US20160011104A1 VOID-ARRANGED STRUCTURE AND MEASUREMENT METHOD USING THE SAME
审中-公开
使用该方法的无偏差结构和测量方法
- Patent Title: VOID-ARRANGED STRUCTURE AND MEASUREMENT METHOD USING THE SAME
- Patent Title (中): 使用该方法的无偏差结构和测量方法
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Application No.: US14862340Application Date: 2015-09-23
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Publication No.: US20160011104A1Publication Date: 2016-01-14
- Inventor: Takashi Kondo , Seiji Kamba , Kazuhiro Takigawa
- Applicant: Murata Manufacturing Co., Ltd.
- Priority: JP2013-062285 20130325
- Main IPC: G01N21/3586
- IPC: G01N21/3586 ; G01N21/01
Abstract:
A void-arranged structure that includes a pair of principal surfaces opposing each other and a plurality of void sections that penetrate through the pair of principal surfaces. The void-arranged structure is configured of a plurality of unit structures each of which includes a first void section and a second void section having a different shape from a shape of the first void section, and the overall shape of the unit structure, when the principal surface is viewed from above, is not mirror-symmetric with respect to a predetermined imaginary plane orthogonal to the principal surface of the void-arranged structure.
Public/Granted literature
- US10408750B2 Void-arranged structure and measurement method using the same Public/Granted day:2019-09-10
Information query
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