Invention Application
- Patent Title: MICROSTRUCTURE AND ELECTRONIC DEVICE
- Patent Title (中): 微结构和电子器件
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Application No.: US14873091Application Date: 2015-10-01
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Publication No.: US20160016792A1Publication Date: 2016-01-21
- Inventor: Ming Fang
- Applicant: STMicroelectronics, Inc.
- Main IPC: B81C1/00
- IPC: B81C1/00

Abstract:
A method of manufacturing microstructures, such as MEMS or NEMS devices, including forming a protective layer on a surface of a moveable component of the microstructure. For example, a silicide layer may be formed on a portion of at least four different surfaces of a poly-silicon mass that is moveable with respect to a substrate of the microstructure. The process may be self-aligning.
Public/Granted literature
- US09604845B2 Methods of forming microstructure and electronic device having moveable component Public/Granted day:2017-03-28
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