Invention Application
US20160016792A1 MICROSTRUCTURE AND ELECTRONIC DEVICE 审中-公开
微结构和电子器件

  • Patent Title: MICROSTRUCTURE AND ELECTRONIC DEVICE
  • Patent Title (中): 微结构和电子器件
  • Application No.: US14873091
    Application Date: 2015-10-01
  • Publication No.: US20160016792A1
    Publication Date: 2016-01-21
  • Inventor: Ming Fang
  • Applicant: STMicroelectronics, Inc.
  • Main IPC: B81C1/00
  • IPC: B81C1/00
MICROSTRUCTURE AND ELECTRONIC DEVICE
Abstract:
A method of manufacturing microstructures, such as MEMS or NEMS devices, including forming a protective layer on a surface of a moveable component of the microstructure. For example, a silicide layer may be formed on a portion of at least four different surfaces of a poly-silicon mass that is moveable with respect to a substrate of the microstructure. The process may be self-aligning.
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