Invention Application
- Patent Title: PRINTED CIRCUIT BOARD MOUNTING AND GROUNDING DEVICE
- Patent Title (中): 印刷电路板安装和接地装置
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Application No.: US14333828Application Date: 2014-07-17
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Publication No.: US20160020538A1Publication Date: 2016-01-21
- Inventor: Ralph W. Jensen , Wesley B. Morgan , James T. Goulding
- Applicant: Intel Corporation
- Main IPC: H01R12/71
- IPC: H01R12/71 ; H01R4/64

Abstract:
Embodiments of the present disclosure are directed toward techniques and configurations for a printed circuit board (PCB) assembly mountable to a computer chassis. In one instance, the PCB assembly may comprise a PCB having two through holes and a PCB mounting device that may include a U-shaped component having a non-linear portion and two rods extended from the non-linear portion and a housing having a base with protrusions extending from ends of the base. The rods may be extended through the protrusions such that the base and the non-linear portion of the U-shaped component form an opening to engage a mounting element of the chassis. The extended portions of the rods may be inserted into and soldered to the through holes of the PCB, to electrically couple the PCB to the PCB mounting device and the chassis to ground the PCB. Other embodiments may be described and/or claimed.
Public/Granted literature
- US09832901B2 Printed circuit board mounting and grounding device Public/Granted day:2017-11-28
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