Invention Application
US20160021735A1 THROUGH-HOLE LAYOUT STRUCTURE, CIRCUIT BOARD, AND ELECTRONIC ASSEMBLY 有权
通孔布局结构,电路板和电子总成

  • Patent Title: THROUGH-HOLE LAYOUT STRUCTURE, CIRCUIT BOARD, AND ELECTRONIC ASSEMBLY
  • Patent Title (中): 通孔布局结构,电路板和电子总成
  • Application No.: US14534170
    Application Date: 2014-11-06
  • Publication No.: US20160021735A1
    Publication Date: 2016-01-21
  • Inventor: Sheng-Yuan Lee
  • Applicant: VIA Technologies, Inc.
  • Priority: TW103131781 20140915
  • Main IPC: H05K1/02
  • IPC: H05K1/02 H01P3/08 H05K1/11
THROUGH-HOLE LAYOUT STRUCTURE, CIRCUIT BOARD, AND ELECTRONIC ASSEMBLY
Abstract:
A through-hole layout structure is suitable for a circuit board. The through-hole layout structure includes a pair of first differential through-holes, a pair of second differential through-holes, a first ground through-hole, a second ground through-hole, and a third ground through-hole, which are all arranged on a first line.The first ground through-hole is located between the pair of first differential through-holes and the pair of second differential through-holes. The pair of first differential through-holes is located between the first ground through-hole and the second ground through-hole. The pair of second differential through-holes is located between the first ground through-hole and the third ground through-hole.
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