Invention Application
- Patent Title: THROUGH-HOLE LAYOUT STRUCTURE, CIRCUIT BOARD, AND ELECTRONIC ASSEMBLY
- Patent Title (中): 通孔布局结构,电路板和电子总成
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Application No.: US14534170Application Date: 2014-11-06
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Publication No.: US20160021735A1Publication Date: 2016-01-21
- Inventor: Sheng-Yuan Lee
- Applicant: VIA Technologies, Inc.
- Priority: TW103131781 20140915
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H01P3/08 ; H05K1/11

Abstract:
A through-hole layout structure is suitable for a circuit board. The through-hole layout structure includes a pair of first differential through-holes, a pair of second differential through-holes, a first ground through-hole, a second ground through-hole, and a third ground through-hole, which are all arranged on a first line.The first ground through-hole is located between the pair of first differential through-holes and the pair of second differential through-holes. The pair of first differential through-holes is located between the first ground through-hole and the second ground through-hole. The pair of second differential through-holes is located between the first ground through-hole and the third ground through-hole.
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