Invention Application
- Patent Title: CONDUCTIVE FILM FORMING COMPOSITION, CONDUCTIVE FILM, AND WIRING BOARD
- Patent Title (中): 导电膜形成组合物,导电膜和接线板
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Application No.: US14869503Application Date: 2015-09-29
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Publication No.: US20160021741A1Publication Date: 2016-01-21
- Inventor: Yasuaki MATSUSHITA , Tokihiko MATSUMURA
- Applicant: FUJIFILM Corporation
- Applicant Address: JP Tokyo
- Assignee: FUJIFILM CORPORATION
- Current Assignee: FUJIFILM CORPORATION
- Current Assignee Address: JP Tokyo
- Priority: JP2013-072642 20130329
- Main IPC: H05K1/09
- IPC: H05K1/09 ; C09D5/24 ; H01B1/22

Abstract:
A conductive film forming composition includes a fluorine atom-containing migration inhibitor and a metal particle, with the migration inhibitor including at least one selected from the group consisting of compounds represented by General Formulae (1) to (5), (22) and (23) as well as compounds having a group of General Formula (24) and a group of General Formula (25). The conductive film forming composition makes it possible to form a conductive film excellent in conductive characteristics and ion migration inhibiting function.
Public/Granted literature
- US09859036B2 Conductive film forming composition, conductive film, and wiring board Public/Granted day:2018-01-02
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