Invention Application
- Patent Title: LASER WELDING OF THRU-HOLE ELECTRICAL COMPONENTS
- Patent Title (中): 三孔电气元件的激光焊接
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Application No.: US14333774Application Date: 2014-07-17
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Publication No.: US20160021747A1Publication Date: 2016-01-21
- Inventor: KIN YEAN CHOW
- Applicant: DELPHI INTERNATIONAL OPERATIONS LUXEMBOURG, S.A.R.L.
- Main IPC: H05K1/11
- IPC: H05K1/11 ; H05K1/18
Abstract:
A circuit board assembly includes a printed circuit board and a component. The printed circuit board includes a plated thru-hole through the printed circuit board. The component includes a lead to interconnect the component to the printed circuit board. The lead is formed to define an opening through the lead. The lead is placed into the plated thru-hole such that at least part of the opening is within the plated thru-hole. The lead is laser welded to the plated thru-hole.
Information query
