Invention Application
- Patent Title: COMPONENT MOUNTING METHOD AND COMPONENT MOUNTING SYSTEM
- Patent Title (中): 组件安装方法和组件安装系统
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Application No.: US14794368Application Date: 2015-07-08
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Publication No.: US20160021761A1Publication Date: 2016-01-21
- Inventor: Isato IWATA , Hirokazu TAKEHARA , Takuya YAMAZAKI , Hiroki SAGARA
- Applicant: Panasonic Intellectual Property Management Co., Ltd.
- Priority: JP2014-146439 20140717
- Main IPC: H05K3/30
- IPC: H05K3/30

Abstract:
A component mounting method is provided in a component mounting apparatus that mounts a component onto a board using a plurality of pieces of production data linked to component data. The method includes executing, when the component data is changed, a simulation of a production cycle time based on the production data, and comparing a simulation result of the production cycle time after change of the component data with a production cycle time or a simulation result of the production cycle time before change of the component data, and outputting a comparison result.
Public/Granted literature
- US10149420B2 Component mounting method and component mounting system Public/Granted day:2018-12-04
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