Invention Application
- Patent Title: Carrier System For Processing Semiconductor Substrates, and Methods Thereof
- Patent Title (中): 用于处理半导体衬底的载体系统及其方法
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Application No.: US14451043Application Date: 2014-08-04
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Publication No.: US20160035560A1Publication Date: 2016-02-04
- Inventor: Manfred Schneegans , Martin Mischitz , Michael Roesner , Michael Pinczolits
- Applicant: Infineon Technologies AG
- Main IPC: H01L21/02
- IPC: H01L21/02 ; H01L21/683 ; H01L21/78
Abstract:
In accordance with an alternative embodiment of the present invention, a method for forming a semiconductor device includes applying a paste over a semiconductor substrate, and forming a ceramic carrier by solidifying the paste. The semiconductor substrate is thinned using the ceramic carrier as a carrier.
Public/Granted literature
- US09640419B2 Carrier system for processing semiconductor substrates, and methods thereof Public/Granted day:2017-05-02
Information query
IPC分类:
