Invention Application
- Patent Title: ATTACHMENT SYSTEM FOR AN ELECTRONIC DEVICE
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Application No.: US14869640Application Date: 2015-09-29
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Publication No.: US20160040698A1Publication Date: 2016-02-11
- Inventor: Ryan C. Perkins , Phillip M. Hobson , Michael J. Webb
- Applicant: Apple Inc.
- Main IPC: F16B2/14
- IPC: F16B2/14 ; F16B2/12 ; F16B17/00 ; F16B2/00

Abstract:
Embodiments of the present disclosure provide a removable module and a housing for an attachment system of a consumer product. The removable module includes a locking mechanism comprising a first portion having a substantially planar top surface and second portion that comprises a substantially non-planar bottom surface. The first portion and the second portion are coupled together. The locking mechanism also includes a first spring mechanism coupled between the first portion and the second portion. The first spring mechanism causes the first portion to be biased away from the second portion. The locking mechanism also includes a second spring mechanism. The second spring mechanism causes the substantially planar top surface of the first portion to be biased substantially flush with respect to the removable module and also causes the substantially non-planar bottom surface of the second portion to be biased proud with respect to the removable module.
Public/Granted literature
- US10264857B2 Attachment system for an electronic device Public/Granted day:2019-04-23
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