Invention Application
US20160041009A1 MICRO-ELECTROMECHANICAL APPARATUS HAVING SIGNAL ATTENUATION-PROOF FUNCTION, AND MANUFACTURING METHOD AND SIGNAL ATTENUATION-PROOF METHOD THEREOF 有权
具有信号衰减功能的微机电装置及其制造方法及其信号衰减验证方法

  • Patent Title: MICRO-ELECTROMECHANICAL APPARATUS HAVING SIGNAL ATTENUATION-PROOF FUNCTION, AND MANUFACTURING METHOD AND SIGNAL ATTENUATION-PROOF METHOD THEREOF
  • Patent Title (中): 具有信号衰减功能的微机电装置及其制造方法及其信号衰减验证方法
  • Application No.: US14885656
    Application Date: 2015-10-16
  • Publication No.: US20160041009A1
    Publication Date: 2016-02-11
  • Inventor: Kelvin Yi-Tse LAIJung-Hsiang CHENCheng-Szu CHENShu-Yi WENG
  • Applicant: Sagatek Co., Ltd.
  • Priority: TW102108324 20130308
  • Main IPC: G01D5/24
  • IPC: G01D5/24 B81C1/00 B81B7/02
MICRO-ELECTROMECHANICAL APPARATUS HAVING SIGNAL ATTENUATION-PROOF FUNCTION, AND MANUFACTURING METHOD AND SIGNAL ATTENUATION-PROOF METHOD THEREOF
Abstract:
A micro-electromechanical apparatus having a signal attenuation-proof function, and a manufacturing method and a signal attenuation-proof method thereof are disclosed. The micro-electromechanical apparatus includes a substrate, an insulation layer, and a sensing unit. The substrate has a doped region in which a majority of conductive carriers have the same polarity as an electronic signal. The insulation layer is located on the substrate, and the sensing unit is located above the insulation layer and forms the electronic signal when sensing a force.
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