Invention Application
US20160045984A1 Laser Processor and Hole-opening Processing Method 有权
激光处理器和开孔处理方法

  • Patent Title: Laser Processor and Hole-opening Processing Method
  • Patent Title (中): 激光处理器和开孔处理方法
  • Application No.: US14783402
    Application Date: 2014-03-31
  • Publication No.: US20160045984A1
    Publication Date: 2016-02-18
  • Inventor: Keita MATSUMOTO
  • Applicant: MURATA MACHINERY, LTD.
  • Applicant Address: JP Kyoto-shi, Kyoto
  • Assignee: Murata Machinery, Ltd.
  • Current Assignee: Murata Machinery, Ltd.
  • Current Assignee Address: JP Kyoto-shi, Kyoto
  • Priority: JP2013-088023 20130419
  • International Application: PCT/JP2014/059559 WO 20140331
  • Main IPC: B23K26/38
  • IPC: B23K26/38 B23K26/08
Laser Processor and Hole-opening Processing Method
Abstract:
A laser processing machine employs a step of forming a pierced hole at a sheet material portion on an inner or outer side of a closed route when a processing to form a hole in the sheet material by cutting along a closed route is carried out. Following this pierced hole a step to perform a cutting process to cut to a predetermined position with a center of the laser beam traversing the closed route and a step of returning, in a condition in which laser irradiation is interrupted, a position of the laser processing head relative to the sheet material to assume a start position lying on the route during a step of cutting to the predetermined position and on the closed route are employed. Thereafter, a step of performing the cutting process from the start position along the closed route is carried out.
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