Invention Application
- Patent Title: Laser Processor and Hole-opening Processing Method
- Patent Title (中): 激光处理器和开孔处理方法
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Application No.: US14783402Application Date: 2014-03-31
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Publication No.: US20160045984A1Publication Date: 2016-02-18
- Inventor: Keita MATSUMOTO
- Applicant: MURATA MACHINERY, LTD.
- Applicant Address: JP Kyoto-shi, Kyoto
- Assignee: Murata Machinery, Ltd.
- Current Assignee: Murata Machinery, Ltd.
- Current Assignee Address: JP Kyoto-shi, Kyoto
- Priority: JP2013-088023 20130419
- International Application: PCT/JP2014/059559 WO 20140331
- Main IPC: B23K26/38
- IPC: B23K26/38 ; B23K26/08

Abstract:
A laser processing machine employs a step of forming a pierced hole at a sheet material portion on an inner or outer side of a closed route when a processing to form a hole in the sheet material by cutting along a closed route is carried out. Following this pierced hole a step to perform a cutting process to cut to a predetermined position with a center of the laser beam traversing the closed route and a step of returning, in a condition in which laser irradiation is interrupted, a position of the laser processing head relative to the sheet material to assume a start position lying on the route during a step of cutting to the predetermined position and on the closed route are employed. Thereafter, a step of performing the cutting process from the start position along the closed route is carried out.
Public/Granted literature
- US09981345B2 Laser processor and hole-opening processing method Public/Granted day:2018-05-29
Information query
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