Invention Application
- Patent Title: HEAT CURABLE ADHESIVE FILM
- Patent Title (中): 热固性胶粘剂
-
Application No.: US14824798Application Date: 2015-08-12
-
Publication No.: US20160046775A1Publication Date: 2016-02-18
- Inventor: FELIX D. MAI , MUTOMBO J. MUVUNDAMINA , BRIAN W. CARLSON , RITUPARNA PAUL
- Applicant: H.B. FULLER COMPANY
- Main IPC: C08J5/18
- IPC: C08J5/18 ; B32B37/14 ; B32B37/10 ; B32B37/06 ; B32B37/12
Abstract:
Disclosed is a one layer adhesive film including a heat curable adhesive and a second adhesive composition. The heat curable adhesive includes a surface-deactivated solid isocyanate and a polymer that includes functional groups that are reactive with isocyanate. A method of making an article that includes the adhesive film and article made thereby are also disclosed.
Information query
