发明申请
- 专利标题： MULTILAYERED CONTACT STRUCTURE HAVING NICKEL, COPPER, AND NICKEL-IRON LAYERS
- 专利标题（中）： 具有镍，铜和镍铁层的多层接触结构
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申请号： US14467191申请日： 2014-08-25
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公开(公告)号： US20160056072A1公开(公告)日： 2016-02-25
- 发明人: Charles L. Arvin , Harry D. Cox , Eric D. Perfecto , Thomas A. Wassick
- 申请人： GLOBALFOUNDRIES, Inc.
- 主分类号： H01L21/768
- IPC分类号： H01L21/768 ; H01L23/532
摘要：
A three dimensional multi-die package includes a first die and second die. The first die includes a contact attached to solder. The second die is thinned by adhesively attaching a handler to a top side of the second die and thinning a bottom side of the second die. The second die includes a multilayer contact of layered metallurgy that inhibits transfer of adhesive thereto. The layered metallurgy includes at least one layer that is wettable to the solder. The multilayer contact may include a Nickel layer, a Copper layer upon the Nickel layer, and a Nickel-Iron layer upon the Copper layer. The multilayer contact may also include a Nickel layer, a Copper-Tin layer upon the Nickel layer, and a Tin layer upon the Copper-Tin layer.
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