发明申请
- 专利标题： BALL GRID ARRAY PACKAGE WITH MORE SIGNAL ROUTING STRUCTURES
- 专利标题（中）： 具有更多信号路由结构的球网阵列包
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申请号： US14463651申请日： 2014-08-19
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公开(公告)号： US20160056094A1公开(公告)日： 2016-02-25
- 发明人: KESVAKUMAR V.C. MUNIANDY , Navas Khan Oratti Kalandar
- 申请人： KESVAKUMAR V.C. MUNIANDY , Navas Khan Oratti Kalandar
- 申请人地址： US TX Austin
- 专利权人： Freescale Semiconductor, Inc.
- 当前专利权人： Freescale Semiconductor, Inc.
- 当前专利权人地址： US TX Austin
- 主分类号： H01L23/495
- IPC分类号： H01L23/495 ; H01L21/56 ; H01L21/48
摘要：
A semiconductor package includes a substrate, a die mounted on a first side of the substrate, an array of solder balls mounted on a second, opposite side of the substrate, and a signal-routing structure mounted on the first side of the substrate and adjacent to the die. The substrate and the signal-routing structure provide electrical connections between die pads on the die and some of the solder balls.
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