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发明申请
US20160056159A1 SEMICONDUCTOR DEVICES HAVING CONTACT PLUGS OVERLAPPING ASSOCIATED BITLINE STRUCTURES AND CONTACT HOLES AND METHOD OF MANUFACTURING THE SAME 有权
具有接触片的半导体器件重叠相关的位线结构和接触孔及其制造方法

  • 专利标题： SEMICONDUCTOR DEVICES HAVING CONTACT PLUGS OVERLAPPING ASSOCIATED BITLINE STRUCTURES AND CONTACT HOLES AND METHOD OF MANUFACTURING THE SAME
  • 专利标题（中）： 具有接触片的半导体器件重叠相关的位线结构和接触孔及其制造方法
  • 申请号： US14754040
    申请日： 2015-06-29
  • 公开(公告)号： US20160056159A1
    公开(公告)日： 2016-02-25
  • 发明人: Jun-Kyum Kim , Jung-Woo Seo , Sung-Un Kwon
  • 申请人： Jun-Kyum Kim , Jung-Woo Seo , Sung-Un Kwon
  • 优先权： KR10-2014-0109042 20140821
  • 主分类号： H01L27/108
  • IPC分类号： H01L27/108 ;  H01L23/535
SEMICONDUCTOR DEVICES HAVING CONTACT PLUGS OVERLAPPING ASSOCIATED BITLINE STRUCTURES AND CONTACT HOLES AND METHOD OF MANUFACTURING THE SAME
摘要：
A semiconductor device can include a plurality of landing pads arranged according to a layout on a substrate, wherein a cross-sectional shape of each of the landing pads has a diamond shape so that opposing interior angles of the diamond shape are equal to one another and adjacent interior angles of the diamond shape are unequal to one another.
摘要（中）：

半导体器件可以包括根据衬底上的布局布置的多个着陆焊盘，其中每个着陆焊盘的横截面形状具有菱形形状，使得菱形形状的相对内部角度彼此相等，并且 钻石形状的相邻内角彼此不相等。

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