Invention Application
- Patent Title: HIGH SPEED SIGNAL CONNECTOR ASSEMBLY
- Patent Title (中): 高速信号连接器总成
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Application No.: US14463716Application Date: 2014-08-20
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Publication No.: US20160056554A1Publication Date: 2016-02-25
- Inventor: Brian Patrick Costello
- Applicant: Tyco Electronics Corporation
- Main IPC: H01R12/70
- IPC: H01R12/70 ; H01R12/75

Abstract:
A connector assembly is configured to provide one or more signal paths between electrical components mounted on at least one component device. The connector assembly may include a printed circuit board (PCB) that supports one or more contacts on a first PCB surface that is opposite from a second PCB surface, a spacer secured over the first PCB surface, wherein at least portions of the one or more contacts are exposed through the spacer, and a support plate secured to the second PCB surface. The support plate is configured to mount the connector assembly to a first device surface that is opposite from a second device surface on which at least one electrical component is mounted.
Public/Granted literature
- US09912084B2 High speed signal connector assembly Public/Granted day:2018-03-06
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