Invention Application
- Patent Title: METHOD FOR FABRICATION OF AN INTEGRATED CIRCUIT RENDERING A REVERSE ENGINEERING OF THE INTEGRATED CIRCUIT MORE DIFFICULT AND CORRESPONDING INTEGRATED CIRCUIT
- Patent Title (中): 整合电路制造方法综合电路的反向工程更多差异和相应的集成电路
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Application No.: US14829292Application Date: 2015-08-18
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Publication No.: US20160064339A1Publication Date: 2016-03-03
- Inventor: Pascal Fornara , Christian Rivero , Guilhem Bouton
- Applicant: STMicroelectronics (Rousset) SAS
- Applicant Address: FR Rousset
- Assignee: STMICROELECTRONICS (ROUSSET) SAS
- Current Assignee: STMICROELECTRONICS (ROUSSET) SAS
- Current Assignee Address: FR Rousset
- Priority: FR1458099 20140829
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L21/768

Abstract:
An integrated circuit includes a substrate with several functional blocks formed thereon. At least two identical functional blocks are respectively disposed at two or more different locations on the integrated circuit. Electrically inactive dummy modules in the neighborhoods and/or inside of the functional blocks are provided, wherein at least two different electrically inactive dummy modules are includes in the respective neighborhoods and/or inside of the at least two identical functional blocks.
Public/Granted literature
Information query
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