Invention Application
US20160064354A1 METHOD FOR ELECTRONIC CIRCUIT ASSEMBLY ON A PAPER SUBSTRATE 有权
电子电路组装在纸基板上的方法

METHOD FOR ELECTRONIC CIRCUIT ASSEMBLY ON A PAPER SUBSTRATE
Abstract:
A methodology for a thin, flexible substrate having integrated passive circuit elements, and the resulting device are disclosed. Embodiments may include integrating one or more passive circuit components on a first or second surface of a substrate, and interconnecting one or more integrated circuit (IC) dies on a second surface of the interposer to the one or more passive circuit components with one or more metal-filled vias between the first and second surfaces, the first and second surfaces being opposite surfaces of the substrate.
Public/Granted literature
Information query
Patent Agency Ranking
0/0