Invention Application
- Patent Title: METHOD FOR ELECTRONIC CIRCUIT ASSEMBLY ON A PAPER SUBSTRATE
- Patent Title (中): 电子电路组装在纸基板上的方法
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Application No.: US14471620Application Date: 2014-08-28
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Publication No.: US20160064354A1Publication Date: 2016-03-03
- Inventor: Saket CHADDA , Ramakanth ALAPATI , Adam BEECE
- Applicant: GLOBALFOUNDRIES INC.
- Main IPC: H01L25/065
- IPC: H01L25/065 ; H01L25/00

Abstract:
A methodology for a thin, flexible substrate having integrated passive circuit elements, and the resulting device are disclosed. Embodiments may include integrating one or more passive circuit components on a first or second surface of a substrate, and interconnecting one or more integrated circuit (IC) dies on a second surface of the interposer to the one or more passive circuit components with one or more metal-filled vias between the first and second surfaces, the first and second surfaces being opposite surfaces of the substrate.
Public/Granted literature
- US09318466B2 Method for electronic circuit assembly on a paper substrate Public/Granted day:2016-04-19
Information query
IPC分类: