发明申请
- 专利标题: METHOD OF MANUFACTURING PRINTED WIRING BOARD
- 专利标题(中): 制造印刷线路板的方法
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申请号: US14938354申请日: 2015-11-11
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公开(公告)号: US20160066431A1公开(公告)日: 2016-03-03
- 发明人: Sohei SAMEJIMA , Tsuyoshi OZAKI , Hiroyuki OSUGA , Teruhiko KUMADA
- 申请人: Mitsubishi Electric Corporation
- 申请人地址: JP Chiyoda-ku
- 专利权人: Mitsubishi Electric Corporation
- 当前专利权人: Mitsubishi Electric Corporation
- 当前专利权人地址: JP Chiyoda-ku
- 优先权: JP2008-330738 20081225; JP2009-105378 20090423
- 主分类号: H05K3/00
- IPC分类号: H05K3/00 ; H05K3/40
摘要:
A method of manufacturing a printed wiring board (10) includes the steps of: forming a core including carbon fiber reinforced plastic having a primary through hole (3a); forming a first adhesive member (4a) on a lower surface of the core to cover the primary through hole (3a); charging an insulating member into the primary through hole (3a); forming a second adhesive member (4b) on an upper surface of the core; forming a third adhesive member (6a) below the first adhesive member (4a); forming a fourth adhesive member (6b) on the second adhesive member (4b); and forming interconnections on the core.
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