Invention Application
- Patent Title: SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR DEVICE
- Patent Title (中): 半导体封装和半导体器件
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Application No.: US14404393Application Date: 2014-03-13
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Publication No.: US20160071777A1Publication Date: 2016-03-10
- Inventor: Kazuhiro YAHATA , Takashi UNO , Hikaru IKEDA
- Applicant: Panasonic Intellectual Property Management Co., Ltd.
- Priority: JP2013-069211 20130328
- International Application: PCT/JP2014/001450 WO 20140313
- Main IPC: H01L23/047
- IPC: H01L23/047 ; H01L23/373 ; H01L23/00 ; H01L23/10
Abstract:
A semiconductor package or a semiconductor device includes a heat sink onto which a semiconductor or a matching circuit is to be placed, a lead terminal which is to be electrically-connected to the semiconductor or the matching circuit on the heat sink, and a securing member which secures the lead terminal to the heat sink, wherein the securing member is formed by a composite resin material in which a resin and a ceramic powder are mixed.
Information query
IPC分类:
