Invention Application
- Patent Title: Methods of Forming Semiconductor Constructions
- Patent Title (中): 形成半导体结构的方法
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Application No.: US14930504Application Date: 2015-11-02
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Publication No.: US20160071878A1Publication Date: 2016-03-10
- Inventor: Neal L. Davis , David A. Kewley
- Applicant: MICRON TECHNOLOGY, INC.
- Applicant Address: US ID Boise
- Assignee: MICRON TECHNOLOGY, INC.
- Current Assignee: MICRON TECHNOLOGY, INC.
- Current Assignee Address: US ID Boise
- Main IPC: H01L27/115
- IPC: H01L27/115

Abstract:
Some embodiments include a semiconductor construction having a stack containing alternating levels of control gate material and intervening dielectric material. A channel material panel extends through the stack and along a first direction. The panel divides the stack into a first section on a first side of the panel and a second section on a second side of the panel. Memory cell stacks are between the channel material panel and the control gate material. The memory cell stacks include cell dielectric material shaped as containers having open ends pointing toward the channel material panel, and include charge-storage material within the containers. Some embodiments include methods of forming semiconductor constructions.
Public/Granted literature
- US09373636B2 Methods of forming semiconductor constructions Public/Granted day:2016-06-21
Information query
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