Invention Application
- Patent Title: INDUCTOR ARRAY CHIP AND BOARD HAVING THE SAME
- Patent Title (中): 电感阵列芯片和具有相同功能的板
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Application No.: US14678912Application Date: 2015-04-03
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Publication No.: US20160078997A1Publication Date: 2016-03-17
- Inventor: Soo Hwan SON , Yu Jin CHOI , Ho Yoon KIM
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Priority: KR10-2014-0122896 20140916
- Main IPC: H01F27/28
- IPC: H01F27/28 ; H01F27/29 ; H05K1/18

Abstract:
There are provided an inductor array chip and a board having the same. The inductor array chip includes: a body in which a plurality of magnetic layers are stacked; first and second coil parts having a plurality of conductive patterns and a plurality of conductive vias formed in the plurality of magnetic layers; and first to fourth external electrodes disposed on outer surfaces of the body to be connected to both ends of the first and second coil parts, wherein the first and second coil parts are disposed in a thickness direction of the body and are separated from each other by a gap layer disposed therebetween.
Information query