Invention Application
- Patent Title: AN APPARATUS FOR PACKAGING THE FRONT FRAMES OF LCD MODULES
- Patent Title (中): 一种用于包装LCD模块前框架的装置
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Application No.: US13983910Application Date: 2013-06-30
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Publication No.: US20160083173A1Publication Date: 2016-03-24
- Inventor: Shih Hsiang CHEN , Qinjun SHI
- Applicant: SHENZHEN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO. LTD.
- Applicant Address: CN Shenzhen,Guangdong
- Assignee: SHENZHEN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Current Assignee: SHENZHEN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Current Assignee Address: CN Shenzhen,Guangdong
- Priority: CN201310226360.9 20130607
- International Application: PCT/CN2013/078546 WO 20130630
- Main IPC: B65D85/38
- IPC: B65D85/38 ; B65D81/05

Abstract:
The present invention discloses an apparatus for packaging the front frames of LCD modules, wherein the apparatus for packaging the front frames of LCD modules comprises a tray, the tray includes a first projection and a second projection formed therein, said first projection and said second projection are arranged at the four inner peripheral sides of the tray, said first projection is adapted to support at least two pieces of front frames in up-down direction, said second projection is adapted to define the positions of said at least two pieces of front frames in front-rear direction and in left-right direction. According to the present invention, the deformation of the front frames can be prevented; meanwhile the cost of packaging can be reduced.
Information query
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