Invention Application
- Patent Title: METHOD FOR MANUFACTURING COPPER ALLOY AND COPPER ALLOY
- Patent Title (中): 制造铜合金和铜合金的方法
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Application No.: US14955318Application Date: 2015-12-01
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Publication No.: US20160083826A1Publication Date: 2016-03-24
- Inventor: Ryoichi MONZEN , Naokuni MURAMATSU
- Applicant: NGK Insulators, Ltd. , National University Corporation Kanazawa University
- Priority: JP2013-117634 20130604
- Main IPC: C22F1/08
- IPC: C22F1/08 ; C22C9/06 ; C21D1/18 ; C22C9/02

Abstract:
A method for manufacturing a copper alloy of the present invention is a method for manufacturing a Cu—Ni—Sn-based copper alloy and includes: a first aging treatment step of performing an aging treatment in a temperature range of 300° C. to 500° C. using a solution treated material; an inter-aging processing step of performing cold working after the first aging treatment step; and a second aging treatment step of performing an aging treatment in a temperature range of 300° C. to 500° C. after the inter-aging processing step. In the first aging treatment step, a peak aging treatment is preferably performed. In addition, in the second aging treatment step, the aging treatment is preferably performed for a short period as compared to that of the aging treatment in the first aging treatment step. In the inter-aging processing step, cold working is preferably performed at a processing rate of more than 60% to 99%.
Public/Granted literature
- US10329654B2 Method for manufacturing copper alloy and copper alloy Public/Granted day:2019-06-25
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