发明申请
- 专利标题： ELECTRODEPOSITION MEDIUMS FOR FORMATION OF PROTECTIVE COATINGS ELECTROCHEMICALLY DEPOSITED ON METAL SUBSTRATES
- 专利标题（中）： 用于形成金属基板电化学保护涂层的电沉积介质
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申请号： US14863104申请日： 2015-09-23
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公开(公告)号： US20160083862A1公开(公告)日： 2016-03-24
- 发明人: Vinod Chintamani Malshe , Sameer Shankar Jadhav , Vitthal Abaso Sawant , Sathish Kumar Ranganathan , Cody R. Davis , Srinivas Siripurapu , Vijay Mhetar , Ryan M. Andersen
- 申请人： GENERAL CABLE TECHNOLOGIES CORPORATION
- 主分类号： C25D9/06
- IPC分类号： C25D9/06
摘要：
Articles including a conductive metal substrate and a protective coating on the metal substrate are provided. The protective coating is electrochemically deposited from an electrodeposition medium including a silicon alkoxide and quaternary ammonium compounds or quaternary phosphonium compounds. Methods of electrochemically depositing such protective coatings are also described herein.