Invention Application
US20160086625A1 CIRCUIT CONNECTION PAD DESIGN FOR IMPROVED ELECTRICAL ROBUSTNESS USING CONDUCTIVE EPOXY 有权
使用导电环氧树脂改善电气稳定性的电路连接垫设计

  • Patent Title: CIRCUIT CONNECTION PAD DESIGN FOR IMPROVED ELECTRICAL ROBUSTNESS USING CONDUCTIVE EPOXY
  • Patent Title (中): 使用导电环氧树脂改善电气稳定性的电路连接垫设计
  • Application No.: US14860921
    Application Date: 2015-09-22
  • Publication No.: US20160086625A1
    Publication Date: 2016-03-24
  • Inventor: Gary BerscheitJackson Brandts
  • Applicant: Seagate Technology LLC
  • Main IPC: G11B5/48
  • IPC: G11B5/48
CIRCUIT CONNECTION PAD DESIGN FOR IMPROVED ELECTRICAL ROBUSTNESS USING CONDUCTIVE EPOXY
Abstract:
Disk drives including head suspensions within dual stage actuation systems have improved electrical connectivity between electrical connection pads from flexible circuits as are applied to head suspension assemblies with piezoelectric microactuators as also provided to head suspension assemblies. A more robust electrical connection provides for better control of microactuator actuation for fine movements and positioning of magnetic read/write heads relative to disk data tracks as part of dual stage actuated suspension systems. Electrical connections utilize conductive epoxy for physically and electrically connecting electrically conductive trace connection pads with one or more surfaces of piezoelectric microactuators. Electrical connections include better conductivity by utilizing plural surface portions of electrical connection pads. The result is a more robust and predictable performance for high data resolution within disk drives.
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