Provided is a method for producing an electrically conductive film including a coating film forming step of forming a coating film by applying an electrically conductive film forming composition including copper oxide particles, copper particles, and an organic compound having at least one functional group selected from the group consisting of a hydroxy group and an amino group and having a temperature at which a mass reduction rate when the film is heated at a temperature rising rate of 10° C./min is 50% within a range of 120° C. to 350° C. to a resin substrate, and an electrically conductive film forming step of forming an electrically conductive film containing metal copper by performing a heat treatment for heating the coating film to a heating temperature of 140° C. to 400° C. at a temperature rising rate of 30° C./min to 10,000° C./min, and an electrically conductive film.