An electronic component and a board having the same are provided. The electronic component includes a multilayer body including a plurality of insulating layers with a bottom surface provided as a mounting surface and a top surface opposing the bottom surface; and external electrodes disposed on opposite end surfaces of the multilayer body in a length direction of the multilayer body. The multilayer body further includes a first protrusion portion disposed on the top surface, and second and third protrusion portions disposed on opposite side surfaces of the multilayer body in a width direction of the multilayer body, and a length of the first protrusion portion in the length direction is shorter than a length of the second and third protrusion portions in the length direction.