Invention Application
US20160086898A1 SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME 有权
半导体封装及其制造方法

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
Abstract:
A semiconductor package includes a wiring substrate including a plurality of solder pads; a chip including a plurality of chip pads connected to the solder pads through a plurality of solders; a sealing layer configured to seal the chip and the solders, at least one void being between the solders; and a solder extrusion prevention layer on one sidewall of the solder exposed by the at least one void.
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