Invention Application
- Patent Title: Diode/Superionic Conductor/Polymer Memory Structure
- Patent Title (中): 二极管/超导体/聚合物存储器结构
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Application No.: US14965660Application Date: 2015-12-10
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Publication No.: US20160087007A1Publication Date: 2016-03-24
- Inventor: Kristy A. Campbell
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Main IPC: H01L27/24
- IPC: H01L27/24 ; H01L45/00

Abstract:
A conjugated polymer layer with a built-in diode is formed by providing a first metal-chalcogenide layer over a bottom electrode. Subsequently, a second metal-chalcogenide layer is provided over and in contact with the first metal-chalcogenide layer. The first metal-chalcogenide layer has a first conductivity type and the second metal-chalcogenide layer has a second conductivity type. The plane of contact between the first and second metal-chalcogenide layers creates the p-n junction of the built-in diode. Then a polymer layer is selectively deposited on the second metal-chalcogenide layer. The second metal-chalcogenide layer provides ions to the polymer layer to change its resistivity. A top electrode is then provided over the polymer layer. An exemplary memory cell may have the following stacked structure: first electrode/n-type semiconductor/p-type semiconductor/conjugated polymer/second electrode.
Public/Granted literature
- US09614004B2 Diode/superionic conductor/polymer memory structure Public/Granted day:2017-04-04
Information query
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