Invention Application
US20160087025A1 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME 有权
半导体器件及其制造方法

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
Abstract:
A semiconductor device includes a semiconductor substrate having a main surface; a first coil formed on the main surface; a first insulating film formed over the first coil and having a first main surface; a second insulating film formed on the first main surface of the first insulating film and having a second main surface; and a second coil formed on the second main surface of the second insulating film, wherein the first main surface of the first insulating film has a first area on which the second insulating film is formed, and has a second area without the first area in a plan view, and wherein the second insulating film is surrounded with the second area in the plane view.
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